电路板制作工艺能力及规格(Capabilities & Specs.)

电路板制作工艺能力及规格(capabilities & specs.)
电路板制作 - 线路板工艺能力及规格

layers:
1 to 20 layers
base materials:
xpc fr1 fr2 cem1 cem3 , fr4,  high tg fr4
base copper thickness:
1oz oz. to 3 oz.
boardthickness:
0.4mm-3.2mm
maximum panel size:
406mm x 610mm
minimum hole diameter:
0.3mm
pth hole tolerance:
0.05mm
aspect ratio:
6:1
blind or buried via:
no
minimum line width:
0.1mm
minimum line spacing:
0.1mm
minimum bonding pitch:
0.127mm
minimum smt pitch:
0.40mm (center to center)
mechanical fabrication:
minimum hole registration tolerance (npth): +/-0.076
minimum hole registration tolerance (pth): +/-0.076mm
minimum pattern registration tolerance: +/-0.076mm
minimum s/m registration tolerance (lpi): +/-0.076mm
minimum annular ring: +/-0.1mm( artwork)
minimum s/m bridge (lpi): 0.1mm
plated gold thickness: 0.01um – 0.025um
immersion gold thickness: 0.025um -- 0.2um
electrical testing:
voltage: 24v - 300v
ontinuity:5 - 100ohms
twist and warp: less than 1% (详细文档:

一个制板工厂的制板规格书.pdf
)
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此篇文章从博客转发
原文地址： Http://blog.gkong.com/more.asp?id=88675&Name=zjcsharp

这是一间中国公司的，PCB规格书，只不过他的这个文档是英文的。